? semiconductor components industries, llc, 2017 february, 2017 ? rev. 0 1 publication order number: NSP8814/d NSP8814, nsp8818 transient voltage suppressors low capacitance surge protection for high speed data the NSP8814 and nsp8818 transient voltage suppressors are designed specifically to protect 10/100 and gbe ethernet signals from high levels of surge current. low clamping voltage under high surge conditions make this device an ideal solution for protecting voltage sensitive lines leading to ethernet transceiver chips. low capacitance combined with flow-through style packaging allows for easy pcb layout and matched trace lengths necessary to maintain consistent impedance between high-speed differential lines. the integrated 4 and 8 lines of protection in flow-thru type packages offer a simplified solution with premier performance for 10/100 and gbe ethernet applications. features ? protection for the following iec standards: iec 61000?4?2 (esd) 30 kv (contact) iec61000?4?5 (lightning) 35 a (8/20 s) ? flow?thru routing scheme ? 2 pf max, i/o to i/o ? ul flammability rating of 94 v?0 ? this is a pb?free device typical applications ? 10/100 and gbe ethernet ? magjacks ? / integrated magnetics ? notebooks/desktops/servers maximum ratings (t j = 25 c unless otherwise noted) rating symbol value unit operating junction temperature range t j ?55 to +125 c storage temperature range t stg ?55 to +150 c lead solder temperature ? maximum (10 seconds) t l 260 c iec 61000?4?2 contact (esd) iec 61000?4?2 air (esd) esd 30 30 kv kv maximum peak pulse current 8/20 s @ t a = 25 c 10/700 s @ t a = 25 c i pp 35 20 a stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. see application note and8308/d for further description of survivability specs. marking diagrams device package shipping ordering information udfn8 case 506cv www. onsemi.com NSP8814mutag udfn8 (pb?free) 3000 / tape & ree l ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. udfn10 case 506cu nsp8818mutag udfn10 (pb?free) 3000 / tape & ree l 4c m xx = specific device code m = date code = pb?free package 4d m
NSP8814, nsp8818 www. onsemi.com 2 figure 1. pin schematic i/o i/o i/o i/o gnd gnd nsp8818 i/o i/o i/o i/o pin1 pin2 pin4 pin5 pin6 pin9 pins 3, 8 note: common gnd ? only minimum of 1 gnd connection required pin7 pin10 i/o i/o i/o i/o gnd gnd gnd gnd NSP8814 pin2 pin3 pin6 pin7 pins 1, 4, 5, 8 note: common gnd ? only minimum of 1 gnd connection required gnd gnd gnd gnd gnd = electrical characteristics (t a = 25 c unless otherwise noted) symbol parameter v rwm working peak voltage i r maximum reverse leakage current @ v rwm v br breakdown voltage @ i t i t test current v hold holding reverse voltage i hold holding reverse current r dyn dynamic resistance i pp maximum peak pulse current v c clamping voltage @ i pp v c = v hold + (i pp * r dyn ) uni?directional surge protection i pp i pp v i i r i t v rwm v cl v br v cl r dyn r dyn electrical characteristics (t a = 25 c unless otherwise specified) parameter symbol conditions min typ max unit reverse working voltage v rwm any i/o to gnd (note 1) 3.0 v forward voltage v f i f = 10 ma, gnd to all io pins 0.5 0.85 1.1 v breakdown voltage v br i t = 1 ma, i/o to gnd 3.2 3.5 5.0 v reverse leakage current i r v rwm = 3.0 v, i/o to gnd 0.5 a clamping voltage v c i pp = 1 a, any i/o to gnd (8/20 s pulse) 5.0 v clamping voltage v c i pp = 10 a, any i/o to gnd (8/20 s pulse) 6.0 v clamping voltage v c i pp = 25 a, any i/o to gnd (8/20 s pulse) 10 v clamping voltage v c i pp = 35 a, any i/o to gnd (8/20 s pulse) 15 v clamping voltage v c iec61000?4?2, 8 kv contact see figures 7 and 8 v junction capacitance c j v r = 0 v, f = 1 mhz between i/o pins 1.5 2.0 pf junction capacitance c j v r = 0 v, f = 1 mhz between i/o pins and gnd 5.0 pf product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. 1. surge protection devices are normally selected according to the working peak reverse voltage (v rwm ), which should be equal or greater than the dc or continuous peak operating voltage level.
NSP8814, nsp8818 www. onsemi.com 3 figure 2. iec61000?4?5 8/20 s pulse waveform time ( s) 50 0 ipp - peak pulse current - %ipp 100 t r = rise time to peak value [8 s] t f = decay time to half value [20 s] t r t f peak value half value 0 figure 3. clamping voltage vs. peak pulse current (t p = 8/20 s per figure 2) 20 18 16 14 12 10 8 6 4 2 0 035 30 25 5101520 i pk (a) v pk (v) io?io io?gnd figure 4. iec61000?4?5 10/700 s pulse waveform time ( s) 50 0 ipp - peak pulse current - %ipp 100 t r = rise time to peak value [10 s] t f = decay time to half value [700 s] t r t f peak value half value 0 figure 5. clamping voltage vs. peak pulse current (t p = 10/700 s per figure 4) 20 18 16 14 12 10 8 6 4 2 0 0 i pk (a) v pk (v) io?io 2 4 6 8 10 12 14 16 18 20 io?gnd figure 6. iec61000?2?4 +8 kv contact clamping voltage 90 ?20 140 120 100 80 0204060 time (ns) voltage (v) 80 70 60 50 40 30 20 10 0 ?10 figure 7. iec61000?2?4 ?8 kv contact clamping voltage 10 ?20 140 120 100 80 0204060 time (ns) voltage (v) 0 ?10 ?20 ?30 ?40 ?50 ?60 ?70 ?80 ?90
NSP8814, nsp8818 www. onsemi.com 4 figure 8. iv characteristics 1.e?01 ?2 6 3 ?1 0 1 2 v (v) i (a) 1.e?02 1.e?03 1.e?04 1.e?05 1.e?06 1.e?07 1.e?08 1.e?09 1.e?10 45 figure 9. cv characteristics 5.0 0 v bias (v) c (pf) 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 io?io 1.e?11 1.e?12 io?gnd figure 10. rf insertion loss figure 11. capacitance over frequency io?gnd io?gnd
NSP8814, nsp8818 www. onsemi.com 5 figure 12. 10/100 ethernet layout diagram and flow?thru routing scheme figure 13. gbe ethernet layout diagram and flow?thru routing scheme NSP8814 rj?45 connector 1 2 3 4 7 8 5 6 rj?45 connector 1 2 3 4 7 8 5 6 nsp8818 black = top layer red = other layer black = top layer red = other layer dfn8 dfn10
NSP8814, nsp8818 www. onsemi.com 6 package dimensions udfn8 2.2x2, 0.575p case 506cv issue a *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. ??? ??? dim min max millimeters a a1 0.00 0.05 a3 b 0.15 0.25 d 2.20 bsc e 2.00 bsc e 0.575 bsc notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimensions b applies to plated terminal and is measured between 0.15 and 0.25 mm from terminal tip. 0.127 ref b l pin one 1 5 4 d e b a c 0.10 c 0.10 2x 2x 8 8x 10x note 3 a c a1 (a3) seating plane c 0.05 c 0.05 0.45 0.55 l 0.25 0.35 reference top view side view bottom view 0.22 2.30 dimensions: millimeters mounting footprint 6x 1 recommended detail a b a c c m 0.10 m 0.05 l2 l1 0.05 0.15 detail b package outline l1 detail a l alternate terminal construction ??? ?? ?? e2 0.40 bsc e3 0.20 bsc l2 0.95 1.05 2x e2 e e3 0.40 0.50 4x 0.575 e2 e e3 0.20 0.20 0.40 0.575
NSP8814, nsp8818 www. onsemi.com 7 package dimensions ??? ??? ??? case 506cu issue o dim min max millimeters a a1 0.00 0.05 a3 b 0.15 0.25 d 3.50 bsc e 2.00 bsc e 0.575 bsc notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimensions b applies to plated terminal and is measured between 0.15 and 0.25 mm from terminal tip. 4. coplanarity applies to the exposed pad as well as the terminals. 0.127 ref b l pin one 1 6 5 d e b a c 0.10 c 0.10 2x 2x 10 e 10x 13x note 3 a note 4 c a1 (a3) seating plane c 0.05 c 0.05 0.45 0.55 l 0.25 0.35 reference top view side view bottom view 0.22 1.10 2.30 dimensions: millimeters mounting footprint* 9x 1 recommended detail a b a c c m 0.10 m 0.05 l2 l1 0.05 0.15 detail b 2x 0.40 package outline l1 detail a l alternate terminal construction ?? ?? e2 0.40 bsc e3 3.10 bsc l2 0.95 1.05 e2 3x e2 e e3 3.50 0.40 0.50 8x 0.575 6x 0.31 2x *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. NSP8814/d magjack is a trademark of bel fuse inc. on semiconductor and are trademarks of semiconductor components industries, llc dba on semiconductor or its subsidiaries i n the united states and/or other countries. on semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . a listing of on semiconductor?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf . on semiconductor reserves the right to make changes without further notice to any products herein. on semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does o n semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. buyer is responsible for its products and applications using on semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by on semiconductor. ?typical? parameters which may be provided in on semiconductor data sheets and/or specifications can and do vary in dif ferent applications and actual performance may vary over time. all operating parameters, including ?typic als? must be validated for each customer application by customer?s technical experts. on semiconductor does not convey any license under its patent rights nor the right s of others. on semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any fda class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. should buyer purchase or use on semicondu ctor products for any such unintended or unauthorized application, buyer shall indemnify and hold on semiconductor and its officers, employees, subsidiaries, affiliates, and distrib utors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that on semiconductor was negligent regarding the design or manufacture of the part. on semiconductor is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 literature fulfillment : literature distribution center for on semiconductor 19521 e. 32nd pkwy, aurora, colorado 80011 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative ?
|
